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SoK: DePIN Data Layer for Modular Blockchain
Conference proceeding

SoK: DePIN Data Layer for Modular Blockchain

Babu Pillai and Vinh Bui
2024 IEEE International Conference on Blockchain and Cryptocurrency (ICBC), pp.1-7
IEEE International Conference on Blockchain and Cryptocurrency (ICBC), 2024 (Dublin, Ireland, 27/05/2024 - 31/05/2024)
2024

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Abstract

Blockchain Layer 2 solutions Scalability Modular design Decentralized Physical Infrastructure Network

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