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Monitoring the curing process of structural adhesives using the electromechanical impedance technique: a numerical investigation
Conference proceeding   Peer reviewed

Monitoring the curing process of structural adhesives using the electromechanical impedance technique: a numerical investigation

Zi Sheng Tang, Yee Yan Lim, Scott T Smith and Nicholas Sirach
APFIS 2019 Proceedings - 7th Asia-Pacific Conference on FRP in Structures
Asia-Pacific Conference on FRP in Structures, Seventh (Surfers Paradise, Gold Coast, 10/12/2019 - 13/12/2019)
10/12/2019

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Abstract

Curing process Electromechanical impedance (EMI) technique Lead zirconate titanate (PZT) Structural adhesive Tensile strength

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