Sign in
Monitoring the curing process of structural adhesives using the electromechanical impedance technique: an experimental investigation
Conference proceeding   Peer reviewed

Monitoring the curing process of structural adhesives using the electromechanical impedance technique: an experimental investigation

Zi Sheng Tang, Yee Yan Lim, Scott T Smith and Nicholas Sirach
APFIS 2019 Proceedings - 7th Asia-Pacific Conference on FRP in Structures
Asia-Pacific Conference on FRP in Structures, Seventh (Surfers Paradise, Australia. , 10/12/2019 - 13/12/2019)
2019

Metrics

28 Record Views

Abstract

Adhesives Curing Elastic Modulus Electromechanical impedance (EMI) technique

Details